Special Wafer Making Machine

Specifications

Special Wafer Making Machine 

Wafer Making Machine

1. Introduction:

Automatic wafer making mahine for 27 plates which is one of KeHua company's traditional products used in product different kind of good wafer, and the capacity about 2.18t/24h. This line had been more reliably and mature via innovative improvements on the basis of advanced technology within this 20 years. 
Baking type:  1. Gas(LNG or LPG),
                        2. Electricity(380V/3 phase/50Hz).
The standard configuration of this wafer making machine: batter mixer, oven, wafer connecting machine, vertical type wafer cooler, wafer collecting machine, cream spreader, wafer cooling tower, wafer conveyor, wafer cutter, cream mixer, wafer smashing machine.

2. Equipment & Process Of Wafer Making Machine:  

Wafer Making Machine
Production process of wafer making machine: batter mixing----wafer baking----cooling----cream spreading----book cooling----cutting

Equipments o wafer making machine: 1.batter mixer 2.oven nnecting machine 4.vertical type cooler llecting machine 6.cream spreader 7.wafer conveyor 8.wafer cutter 9.cream mixer 10.wafer smashing machine.

The real pictures of waer making machine:

Wafer pictures(by wafer making machine):

3. Specialty & Using:

Products Distinguishing Feature:

Wafer Making Machine:

1. The oven has 27 plates and they made of nodular cast iron, the standard dimension of baking plate is 470*325mm. The power transistor and travelling wheel have the Chinese patent, the line have PID temperature automatic control system and the good affect for wafer sheet. 
2. Batter mixer is made of Stainless Steel. It can mixing 65kg batter with 25kg flour and 40kg water within 5 minutes.
3. Vertical type wafer cooler is made of Stainless Steel and using the own motor.
4. The racks of cream spreader are the stainless steel tank, the motor and pneumatic component which both seal in the tank have good waterproof and dustproof. The spreader has the easy clear design.
5. Wafer cooling tower is made of Stainless Steel, and the part which touch the wafer book are all made of Stainless Steel 304. The cooling fan is outlay and the temperature of cooler’s inlet air are 5C. The relative humidity of cooling tower is 55%.
6. Wafer cutter is mechanically and the maximum speed of cutting wafer book(filled with cream) are 8 books.

Using: Wafer making machine is exclusively used in produce different kind of good wafer.

4. Technical advantage:

(1) In the field of wafer machines have more than 15 years experiences.
(2) According to HACCP design, the controlling and operating for the important equipment will be more accurately and safely.
(3) Have CE, ISO9001:2000, FM.
(4) Professional design, material selection more scientifically, processing more accurately.
(5) Good quality.
(6) Best service and perfect after sale service.

5. Technical Parameter:
 
Wafer making machine:

[1] Baking oven's length(m)---6m;
[2] The complete line's length(m)---17.9m;
[3] The total weight of wafer line(T)---13T;
[4] Power(kw)---5.15kw;
[5] LNG consumption(m3/h)---21m3/h;
[6] Air compression consumption(m3/h)---36m3/h;
[7] Capacity(kg/h)---91kg/h.

Parameter: 
1) The standard size of the baking plate is 470*325mm;  Pattern(standard) is 2.5*2.5*0.5mm;
2) The size of wafer sheet is 464*321mm; The effective cutting size of wafer sheet is 456*315mm; 
3) Wafer sheet's thickness: 2.5mm---3.2mm;
4) Weight of wafer sheet: 50---60g;
5) Rated power: 30kw;
6) Air compression consumption: 0.9cube/minute;
7) Baking time about 2 minutes;
8) Worker: 4 to 5 people.

Space: machines using 60 square meter

6.Packaging & Container
Packaging: iron and waterproof membrane.
Container: one 40'HQ.

[Note]: We can make different pattern for the plate according to client's demands.